Technical parameters/operating temperature (Max): 70 ℃
Technical parameters/operating temperature (Min): 0 ℃
Encapsulation parameters/installation method: Through Hole
Package parameters/number of pins: 28
Encapsulation parameters/Encapsulation: DIP
External dimensions/height: 3.3 mm
External dimensions/packaging: DIP
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tube
Compliant with standards/RoHS standards: Non-Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
71256SA12TPG
|
Integrated Device Technology | 完全替代 | PDIP-28 |
SRAM, 256 Kbit, 32K x 8位, 4.5V 至 5.5V, DIP, 28 引脚, 12 ns
|
||
AS7C256B-12PIN
|
Alliance Memory | 类似代替 | DIP |
SRAM Chip Async Single 5V 256Kbit 32K x 8 12ns 28Pin PDIP
|
||
IDT71256SA12TP
|
Integrated Device Technology | 类似代替 | DIP-28 |
CMOS静态RAM 256K ( 32K ×8位) CMOS STATIC RAM 256K (32K x 8-BIT)
|
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