Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: LQFP
External dimensions/packaging: LQFP
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
Customs information/ECCN code: EAR99
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
IDT72V815L15PFI
|
Panasonic | 功能相似 |
3.3伏的CMOS双SyncFIFO DUAL 256 ×18 ,双512× 18 ,双1024 ×18 ,双2048 ×18 3.3 VOLT CMOS DUAL SyncFIFO DUAL 256 x 18, DUAL 512 x 18, DUAL 1,024 x 18, DUAL 2,048 x 18
|
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IDT72V815L15PFI
|
Integrated Device Technology | 功能相似 | LQFP |
3.3伏的CMOS双SyncFIFO DUAL 256 ×18 ,双512× 18 ,双1024 ×18 ,双2048 ×18 3.3 VOLT CMOS DUAL SyncFIFO DUAL 256 x 18, DUAL 512 x 18, DUAL 1,024 x 18, DUAL 2,048 x 18
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