Encapsulation parameters/installation method: Through Hole
Package parameters/number of pins: 20
Encapsulation parameters/Encapsulation: CDIP
External dimensions/length: 25.4 mm
External dimensions/width: 7.62 mm
External dimensions/packaging: CDIP
External dimensions/thickness: 2.90 mm
Other/Product Lifecycle: Obsolete
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual |
|---|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review