Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Active
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
CY7C429-40LMB
|
Cypress Semiconductor | 功能相似 | QCCN |
FIFO, 2KX9, 40ns, Asynchronous, CMOS, CQCC32, CERAMIC, LCC-32
|
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