Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: TQFP
External dimensions/packaging: TQFP
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tray
Customs information/ECCN code: 3A991
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
IDT70V38L20PFI8
|
Integrated Device Technology | 功能相似 | LQFP |
64K x 18 3.3V Dual-Port RAM
|
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