Encapsulation parameters/installation method: Through Hole
Encapsulation parameters/Encapsulation: Radial
External dimensions/packaging: Radial
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
B32529C3222J000
|
Epcos | 功能相似 |
CAP FILM 2200pF 5% 250VDC RADIAL
|
|||
B32529C3222J000
|
TDK | 功能相似 | - |
CAP FILM 2200pF 5% 250VDC RADIAL
|
||
B32562J3155K000
|
TDK-EPC | 功能相似 | DIP-2 |
CAP FILM 1.5uF 10% 250VDC 2DIP
|
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