Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: SOIC-8
External dimensions/packaging: SOIC-8
Other/Product Lifecycle: Supply in progress
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
TI | 功能相似 |
DDR 终止稳压器
|
|||
|
|
National | 功能相似 |
DDR 终止稳压器
|
|||
LP2996-N
|
TI | 功能相似 | WQFN-16 |
具有关断引脚的 1.5A DDR 终端稳压器
|
||
LP2997
|
TI | 功能相似 | SOIC-8 |
DDR-II 终止稳压器
|
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