Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: SSOP-16
External dimensions/packaging: SSOP-16
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Cut Tape (CT)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Customs information/ECCN code: EAR99
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
SN74CBT3251DBQRE4
|
TI | 功能相似 | SSOP-16 |
1 -OF- 8的FET用/解复用器 1-OF-8 FET MULTIPLEXER/DEMULTIPLEXER
|
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