Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 16
Encapsulation parameters/Encapsulation: DFN
External dimensions/packaging: DFN
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: Non-Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
ADI | 功能相似 | DFN |
IC OPAMP GP 18MHz RRO 16DFN
|
||
LTC6242HVCDHC#TRPBF
|
Linear Technology | 功能相似 | DFN-16 |
IC OPAMP GP 18MHz RRO 16DFN
|
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