Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Obsolete
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
TI | 功能相似 | DIP |
锁存器 DM54LS75J/883 -
|
||
DM54LS75J/883
|
National Semiconductor | 功能相似 | DIP |
锁存器 DM54LS75J/883 -
|
||
|
|
ST Microelectronics | 功能相似 | DIP |
四三态R-S锁存器 QUAD 3-STATE R-S LATCHES
|
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