Encapsulation parameters/installation method: Through Hole
Package parameters/number of pins: 28
Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Unknown
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
5962-8866203NA
|
E2V | 功能相似 | DIP |
SRAM Chip Async Single 5V 256Kbit 32K x 8 55ns 28Pin CDIP
|
||
5962-8866203NA
|
QP Semiconductor | 功能相似 |
SRAM Chip Async Single 5V 256Kbit 32K x 8 55ns 28Pin CDIP
|
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