Technical parameters/operating temperature (Max): 70 ℃
Technical parameters/operating temperature (Min): 0 ℃
Technical parameters/power supply voltage: 3.3 V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 119
Encapsulation parameters/Encapsulation: BGA
External dimensions/height: 1.46 mm
External dimensions/packaging: BGA
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
CY7C1366C-166BGC
|
Cypress Semiconductor | 功能相似 | BGA-119 |
9兆位( 256K ×36 / 512K ×18 )流水线DCD同步SRAM 9-Mbit (256K x 36/512K x 18) Pipelined DCD Sync SRAM
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