Encapsulation parameters/installation method: Through Hole
Encapsulation parameters/Encapsulation: DIP-28
External dimensions/packaging: DIP-28
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tube
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
Customs information/ECCN code: EAR99
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
7202LA50JG
|
Renesas Electronics | 功能相似 | LCC-32 |
FIFO Mem Async Dual Depth/Width Uni-Dir 1K x 9 32Pin PLCC
|
||
7202LA50JG
|
Integrated Device Technology | 功能相似 | PLCC-32 |
FIFO Mem Async Dual Depth/Width Uni-Dir 1K x 9 32Pin PLCC
|
||
|
|
Renesas Electronics | 功能相似 | LCC-32 |
FIFO Mem Async Dual Depth/Width Uni-Dir 1K x 9 32Pin PLCC T/R
|
||
7202LA50JG8
|
Integrated Device Technology | 功能相似 | PLCC-32 |
FIFO Mem Async Dual Depth/Width Uni-Dir 1K x 9 32Pin PLCC T/R
|
||
IDT7202LA50SO
|
Integrated Device Technology | 功能相似 | SOIC-28 |
CMOS异步FIFO 256 ×9 , 512× 9 , 1K ×9 CMOS ASYNCHRONOUS FIFO 256 x 9, 512 x 9, 1K x 9
|
||
IDT7202LA50SO
|
Renesas Electronics | 功能相似 | SOIC-28 |
CMOS异步FIFO 256 ×9 , 512× 9 , 1K ×9 CMOS ASYNCHRONOUS FIFO 256 x 9, 512 x 9, 1K x 9
|
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