Encapsulation parameters/installation method: Through Hole
Encapsulation parameters/Encapsulation: TS-1-2
External dimensions/packaging: TS-1-2
Other/Product Lifecycle: Obsolete
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
ERA15-06
|
EIC | 功能相似 | DO-41 |
SILICON RECTIFIER DIODES
|
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