Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 8
Encapsulation parameters/Encapsulation: SOIC
External dimensions/packaging: SOIC
Physical parameters/operating temperature: -25℃ ~ 85℃
Other/Product Lifecycle: Obsolete
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
HV823LG-G
|
Supertex | 类似代替 | SOIC |
EL Lamp DRVR 9.5V 8Pin SOIC N
|
||
|
|
Suptertex | 功能相似 |
EL Lamp DRVR 5.8V 10Pin DFN EP
|
|||
HV839K6-G
|
Supertex | 功能相似 | DFN-10 |
EL Lamp DRVR 5.8V 10Pin DFN EP
|
||
HV857MG-G
|
Microchip | 功能相似 | MSOP-8 |
EL Lamp DRVR 5V 8Pin MSOP
|
||
HV857MG-G
|
Supertex | 功能相似 | MSOP-8 |
EL Lamp DRVR 5V 8Pin MSOP
|
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