Package parameters/number of pins: 8
Encapsulation parameters/Encapsulation: HVSSOP
External dimensions/packaging: HVSSOP
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tube
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
24LC02BHT-I/MNY
|
Microchip | 功能相似 | TDFN-8 |
电可擦除可编程只读存储器 2K 256 X 8 SERIAL EE 2.5V IND 1/2 ARRAYWP
|
||
24LC02BT-I/MNY
|
Microchip | 功能相似 | TDFN-8 |
2K I2C ™串行EEPROM 2K I2C™ Serial EEPROM
|
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