Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: SOIC
External dimensions/packaging: SOIC
Other/Product Lifecycle: Obsolete
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
TLC2201ACD
|
TI | 功能相似 | SOIC-8 |
LinCMOS 运算放大器
|
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TLC2201IP
|
TI | 功能相似 | PDIP-8 |
TEXAS INSTRUMENTS TLC2201IP 运算放大器, 单路, 1.9 MHz, 1个放大器, 2.7 V/µs, ± 2.3V 至 ± 8V, DIP, 8 引脚
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