Encapsulation parameters/Encapsulation: TFSOP-38
External dimensions/packaging: TFSOP-38
Other/Product Lifecycle: Active
Other/Packaging Methods: Tape & Reel (TR)
Other/Manufacturing Applications: xeltek, Lauterbach, altium, elnec, zhiyuan_logo, port_logo, hilo-logo, hitex, algocraft-Logo, Dave_Bench, euros, Phyton Inc., Keil_logo_new, logo_smh_120, bpm_microsystems, keil, iar
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
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