Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 48
Encapsulation parameters/Encapsulation: TSSOP
External dimensions/length: 18.4 mm
External dimensions/width: 12 mm
External dimensions/packaging: TSSOP
Other/Product Lifecycle: Obsolete
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
AM29F200BB-70EF
|
Spansion | 功能相似 | TSOP-48 |
IC, FLASH, 2Mbit, 70NS, TSOP-48
|
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