Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 20
Encapsulation parameters/Encapsulation: QSOP
External dimensions/length: 8.70 mm
External dimensions/width: 3.80 mm
External dimensions/packaging: QSOP
External dimensions/thickness: 1.47 mm
Other/Product Lifecycle: Obsolete
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
74LVC541AQ
|
Integrated Device Technology | 功能相似 | QSOP |
Buffer Line Driver
|
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