Package parameters/number of pins: 360
Encapsulation parameters/Encapsulation: BGA
External dimensions/packaging: BGA
Other/Product Lifecycle: Obsolete
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
PC755CVGH400LE
|
E2V | 功能相似 | BGA |
MPU PowerPC 755 Processor RISC 32Bit 0.22um 400MHz 2.5V/3.3V 360Pin HITCE CBGA
|
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