Encapsulation parameters/installation method: Through Hole
Package parameters/number of pins: 14
Encapsulation parameters/Encapsulation: PDIP
External dimensions/packaging: PDIP
Other/Product Lifecycle: Obsolete
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
CD4006BF3A
|
TI | 功能相似 | CDIP-16 |
CMOS 18级静态移位寄存器 CMOS 18-Stage Static Shift Register
|
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