Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: TO-252
External dimensions/packaging: TO-252
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tube
Compliant with standards/RoHS standards: Non-Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
L4931ABDT50-TR
|
ST Microelectronics | 功能相似 | TO-252-3 |
5V 0.25A 3引脚 (2引线+焊片) DPAK 采用卷盘包装
|
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