Encapsulation parameters/Encapsulation: SOP
External dimensions/packaging: SOP
Other/Product Lifecycle: Active
Other/Packaging Methods: Tube, Rail
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
8257
|
TE Connectivity | 功能相似 |
EEPROM, 32KX8, 120ns, Parallel, CMOS, PDSO28, PLASTIC, SOIC-28
|
|||
|
|
Xicor | 功能相似 | SOP |
E2 Micro-Peripheral
|
||
X68257SI
|
Xicor | 功能相似 | SOP |
E2 Micro-Peripheral
|
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