Technical parameters/power supply current: 280 mA
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 84
Encapsulation parameters/Encapsulation: BGA
External dimensions/packaging: BGA
Physical parameters/operating temperature: -40℃ ~ 85℃
Other/Product Lifecycle: Obsolete
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
IS43DR16128-3DBL
|
Integrated Silicon Solution | 类似代替 | BGA-84 |
动态随机存取存储器 2G (128Mx16) 333Mhz DDR2 1.8v
|
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