Encapsulation parameters/Encapsulation: TSSOP
External dimensions/packaging: TSSOP
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
M24256-BRDW6G
|
ST Microelectronics | 功能相似 | TSSOP |
256Kbit和128Kbit的串行I2C总线的EEPROM采用三片选线 256Kbit and 128Kbit Serial I2C Bus EEPROM With Three Chip Enable Lines
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