Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 3
Encapsulation parameters/Encapsulation: TSSOP
External dimensions/packaging: TSSOP
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tube, Rail
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
LM4040CEM3-2.1+T
|
Maxim Integrated | 功能相似 | SOT-23-3 |
电压基准, 并联 - 固定, 2.048V, 0.5%Ref, ±15ppm/°C, SOT-23-3
|
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