Encapsulation parameters/installation method: Through Hole
Package parameters/number of pins: 24
Encapsulation parameters/Encapsulation: PDIP
External dimensions/packaging: PDIP
Other/Product Lifecycle: Unknown
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
74F823SPC
|
National Semiconductor | 功能相似 | DIP |
9位D型触发器 9-Bit D-Type Flip-Flop
|
||
74F823SPC
|
Fairchild | 功能相似 | DIP-24 |
9位D型触发器 9-Bit D-Type Flip-Flop
|
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