Encapsulation parameters/installation method: Through Hole
Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Obsolete
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
TI | 功能相似 | DIP |
HEX ECL TO TTL TRANSLATOR, TRUE OUTPUT, CDIP24, 0.400 INCH, CERAMIC, DIP-24
|
||
100325DC
|
National Semiconductor | 功能相似 | DIP |
HEX ECL TO TTL TRANSLATOR, TRUE OUTPUT, CDIP24, 0.400 INCH, CERAMIC, DIP-24
|
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