Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Obsolete
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
PAL16R4D/2PC
|
AMD | 功能相似 | DIP |
20Pin TTL Programmable Array Logic
|
||
TIBPAL16R4-10CN
|
TI | 功能相似 | DIP-20 |
TEXAS INSTRUMENTS TIBPAL16R4-10CN 可编程逻辑芯片, PAL, Impact-X, 10NS, 20-DIP
|
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