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Description 36The 2-Word Burst Architecture of 36 Mbit DDR-II SRAM with Megabit DDR-II SRAM
Product QR code
Packaging FBGA
Delivery time
Packaging method Tray, Bulk
Standard packaging quantity 1
0yuan
  • Freight charges   In stock Freight rate:$13.00
  • Quantity
    Inventory(7299) Minimum order quantity(1)
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Technical parameters/power supply voltage (DC): 1.80 V, 1.90 V (max)

Technical parameters/clock frequency: 250MHz (max)

Technical parameters/access time: 0.45 ns

Technical parameters/memory capacity: 36000000 B

Technical parameters/operating temperature (Max): 70 ℃

Technical parameters/operating temperature (Min): 0 ℃

Encapsulation parameters/installation method: Surface Mount

Package parameters/number of pins: 165

Encapsulation parameters/Encapsulation: FBGA

External dimensions/packaging: FBGA

Physical parameters/operating temperature: 0℃ ~ 70℃

Other/Product Lifecycle: Unknown

Other/Packaging Methods: Tray, Bulk

Compliant with standards/RoHS standards: RoHS Compliant

Compliant with standards/lead standards: Lead Free

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Alternative material

Model Brand Similarity Encapsulation Introduction Data manual
CY7C1418AV18-250BZC CY7C1418AV18-250BZC Cypress Semiconductor 类似代替 LBGA-165
36兆位的DDR - II SRAM的2字突发架构 36-Mbit DDR-II SRAM 2-Word Burst Architecture
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