Encapsulation parameters/installation method: Through Hole
Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tube
Customs information/ECCN code: EAR99
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
IDT7132LA35C
|
Integrated Device Technology | 功能相似 | DIP |
HIGH -SPEED 2K ×8双端口静态对中断RAM HIGH-SPEED 2K x 8 DUAL-PORT STATIC RAM WITH INTERRUPTS
|
||
IDT7132SA35P
|
Integrated Device Technology | 功能相似 | DIP |
HIGH -SPEED 2K ×8双端口静态对中断RAM HIGH-SPEED 2K x 8 DUAL-PORT STATIC RAM WITH INTERRUPTS
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review