Package parameters/number of pins: 5
Encapsulation parameters/Encapsulation: TSSOP
External dimensions/packaging: TSSOP
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
HD74LV1G04ACME
|
Renesas Electronics | 功能相似 | CMPAK-5 |
IC 反相器 HD74LV1G04ACME SOT-353/CMPAK-5 marking/标记 L5
|
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