Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: SSOP
External dimensions/packaging: SSOP
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Customs information/ECCN code: EAR99
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
IDT74FCT162827CTPVG
|
Integrated Device Technology | 功能相似 | SSOP |
IC BUFFER 20Bit FAST 56-SSOP
|
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