Technical parameters/number of output interfaces: 1
Technical parameters/topology structure: Buck
Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: TO-263
External dimensions/packaging: TO-263
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
LT1076IR#TRPBF
|
Linear Technology | 类似代替 | TO-263-8 |
DC-DC电源芯片 LT1076IR#TRPBF DDPAK-7
|
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