Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 6
Encapsulation parameters/Encapsulation: VSON
External dimensions/packaging: VSON
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tube, Rail
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
MAX5903LCETT+T
|
Maxim Integrated | 功能相似 | WDFN-6 |
Hot Swap Controller 1CH 72V 6Pin TDFN EP T/R
|
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