Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: QFP
External dimensions/packaging: QFP
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
Customs information/ECCN code: EAR99
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
IDT72V255LA10PF
|
Integrated Device Technology | 功能相似 | TQFP-64 |
3.3伏的CMOS SuperSync FIFO 8,192 ×18 16,384 ×18 3.3 VOLT CMOS SuperSync FIFO 8,192 x 18 16,384 x 18
|
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