Package parameters/number of pins: 119
Encapsulation parameters/Encapsulation: FBGA
External dimensions/packaging: FBGA
Physical parameters/operating temperature: -40℃ ~ 85℃
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
GSI | 类似代替 | FBGA |
SRAM Chip Async Quad 3.3V 8M-Bit 256K x 32 10ns 119Pin F-BGA Tray
|
||
GS78132AGB-8I
|
GSI | 类似代替 | FBGA |
SRAM Chip Async Quad 3.3V 8M-bit 256K x 32 8ns 119Pin FBGA Tray
|
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