Technical parameters/power supply voltage: 0.95V ~ 1.05V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 665
Encapsulation parameters/Encapsulation: FCBGA-665
External dimensions/packaging: FCBGA-665
Physical parameters/operating temperature: 0℃ ~ 85℃
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Xilinx | 完全替代 | BBGA-665 |
XC5VFX70T 2FF665C 磨码
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