Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: 1008
External dimensions/packaging: 1008
Other/Product Lifecycle: Active
Other/Manufacturing Applications: Mobile phone adapter, Bluetooth/WIFI module, mobile phone
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
LQM2HPN1R0MG0L
|
muRata | 功能相似 | 1008 |
MURATA LQM2HPN1R0MG0L 表面贴装高频电感器, LQM2HPN系列, 1 µH, ± 20%, 1008 [2520 公制], 60 MHz, 0.069 ohm
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review