Package parameters/number of pins: 20
Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Obsolete
Compliant with standards/RoHS standards: Non-Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
5962-8515505RX
|
TI | 功能相似 | DIP |
OT PLD, 30ns, CDIP20, CERAMIC, DIP-20
|
||
5962-8515508RX
|
TI | 功能相似 | DIP |
OT PLD, 30ns, CDIP20
|
||
5962-8871311RA
|
QP Semiconductor | 功能相似 | DIP |
OT PLD, 20ns, CMOS, CDIP20, 0.3INCH, CERDIP-20
|
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