Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: TSSOP
External dimensions/packaging: TSSOP
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tube, Rail
Compliant with standards/RoHS standards: Non-Compliant
Customs information/ECCN code: EAR99
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
74VCX164245MTD
|
Fairchild | 功能相似 | TSSOP-48 |
FAIRCHILD SEMICONDUCTOR 74VCX164245MTD 逻辑芯片, 电平转换器/收发器, 48TSSOP
|
||
SN74ALVC164245DGGR
|
TI | 功能相似 | TSSOP-48 |
TEXAS INSTRUMENTS SN74ALVC164245DGGR 收发器, 非反相, 2.3V至3.6V, 3V至5.5V, TSSOP-48
|
||
SN74ALVC164245DGGT
|
NXP | 功能相似 |
TEXAS INSTRUMENTS SN74ALVC164245DGGT 逻辑芯片, 收发器, 三态, 16位, 48TSSOP
|
|||
SN74ALVC164245DGGT
|
TI | 功能相似 | TSSOP-48 |
TEXAS INSTRUMENTS SN74ALVC164245DGGT 逻辑芯片, 收发器, 三态, 16位, 48TSSOP
|
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