Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
PAL20R8ACJS
|
AMD | 功能相似 | DIP |
24Pin TTL Programmable Array Logic
|
||
TIBPAL20R8-25CNT
|
TI | 功能相似 | DIP-24 |
低功耗高性能影响é PAL电路 LOW-POWER HIGH-PERFORMANCE IMPACT E PAL CIRCUITS
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review