Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: LQFP
External dimensions/packaging: LQFP
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
Customs information/ECCN code: EAR99
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
IDT72V261LA10PFG8
|
Integrated Device Technology | 功能相似 | LQFP |
FIFO, 16KX9, 6.5ns, Synchronous, CMOS, PQFP64, PLASTIC, TQFP-64
|
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