Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: QFN-32
External dimensions/packaging: QFN-32
Other/Product Lifecycle: Supply in progress
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
TLV320AIC3110
|
TI | 功能相似 | QFN-32 |
具有 1.3W 立体声 D 类扬声器放大器的低功耗音频编解码器
|
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