Encapsulation parameters/Encapsulation: TSSOP
External dimensions/packaging: TSSOP
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
MAX6383XR17D3+
|
Maxim Integrated | 功能相似 | SOIC |
Ic Mpu/Reset Circ 1.67V Sc70-3
|
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