Technical parameters/Holding current (Max): 150mA (Min)
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 8
Encapsulation parameters/Encapsulation: SOIC
External dimensions/packaging: SOIC
Physical parameters/operating temperature: -65℃ ~ 150℃
Other/Product Lifecycle: Obsolete
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
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Bourns J.W. Miller | 类似代替 | SIP-3 |
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Bourns J.W. Miller | 类似代替 | SOIC-8 |
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Power Innovations | 类似代替 |
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