Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: TSSOP-24
External dimensions/packaging: TSSOP-24
Other/Product Lifecycle: Supply in progress
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
ADC08060
|
TI | 功能相似 | TSSOP-24 |
具有内部采样和保持的 8 位、20 MSPS 至 60 MSPS、1.3 mW/MSPS A/D 转换器
|
||
ADC08B200-Q1
|
TI | 功能相似 |
具有捕捉缓冲器的 8 位、200 MSPS A/D 转换器
|
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