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Model IDT72V2103L6PF
Description 3.3Voltage High Density SUPERSYNC II Narrow Bus FIFO 3.3 VOLT HIGH-DENSITY SUPERSYNC II NARROW BUS FIFO
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Brand: Integrated Device Technology
Packaging LQFP
Delivery time
Packaging method Tray
Standard packaging quantity 1
0yuan
  • Freight charges：   In stock Freight rate：$13.00
  • Quantity： Inventory(6792) Minimum order quantity(1)
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Encapsulation parameters/installation method: Surface Mount

Encapsulation parameters/Encapsulation: LQFP

External dimensions/packaging: LQFP

Other/Product Lifecycle: Unknown

Other/Packaging Methods: Tray

Compliant with standards/RoHS standards: Non-Compliant

Compliant with standards/lead standards: Contains Lead

Customs information/ECCN code: EAR99

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Alternative material

Model Brand Similarity Encapsulation Introduction Data manual
72V2103L10PFI 72V2103L10PFI Integrated Device Technology 功能相似 TQFP-80
FIFO Mem Sync Dual Depth/Width Uni-Dir 128K x 18/256K x 9 80Pin TQFP Tray
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