Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Unknown
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
27C256I12N
|
Philips | 功能相似 | DIP |
256Kbit CMOS EPROM (32K x 8)
|
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